(Above) Stress measurements for two points near the ends of the microwire during electromigration. For the left end, stress continuously decreased because of removal of atoms by
electromigration. For the right end, stress increased because of addition of atoms by electromigration, until
breakdown occurred after about fifteen hours. (Thanks to Slade Cargill of Columbia University
for supplying the figures and much of this text.)
This research was described at the 1997 March Meeting of the American
Physical Society in Kansas City, Missouri.
