Number 10 (Story #5), November 27, 1990 by Phillip F. Schewe and Ben Stein SOLID STATE MICROBATTERIES ,now in development, may help facilitate three-dimensional high-density integrated circuit technology by providing power to components locally rather than from a remote source, thus reducing "crosstalk" between circuits. The new microbatteries, fabricated by laying down thin films with molecular beams, will be only 5 microns thick. (Physics World, November 1990.)