Number 186, July 5, 1994 by Phillip F. Schewe and Ben Stein
NEAR-FIELD OPTICAL MICROSCOPES can achieve a spatial resolution of a
fraction of a light wavelength by positioning the optical source only tens
of nm from the sample. By working in this "near field," scientists
can greatly reduce the resolution-limiting effects of diffraction. Physicists
at AT&T Bell Labs were able to image dye molecules with a resolution
of less than 100 nm using laser light with a wavelength of 600 nm brought
to the sample in an optical fiber tapered at the tip to only 20 nm. (Physics
Today, May 1994.) Using the incident light to excite photoluminescence
in a sample, the microscope becomes a spectrometer with potentially high
spatial and energy resolution. In this way, the Bell Labs researchers are
beginning to resolve individual centers of luminescence in quantum wells,
structures in which electrons are confined to an essentially 2-dimensional
GaAs region sandwiched between AlGaAs layers. The study of quantum wells
in such fine (spatial) detail is important since they play a key role in
certain high- tech lasers and transistors. (H.F. Hess et al., Science,
17 June 1994.)
THE EVIDENCE FOR TOP QUARK PRODUCTION , announced by the Collider Detector
at Fermilab (CDF) collaboration in April, is now officially published in
Physical Review Letters (PRL). An abbreviated form of a much longer article
that will appear later in the journal Physical Review D, the PRL account
does not much add to the salient facts established in April, namely the
observation of 12 events consistent with top production, with an estimated
cross section of 13.9 picobarns and an estimated top mass (based on analysis
of 7 of the 12 events) of 174 GeV. (F. Abe et al., Phys. Rev. Lett., 11
July.)
INTEGRATED CIRCUITS ARE MOSTLY TWO-DIMENSIONAL , whereas nature more
efficiently works in three dimensions. The human retina, for example, is
a massively-parallel, 3D imaging system consisting of a layer of sensing
cells (rod and cone cells), two layers of processing cells (bipolar and
ganglion) and two layers of interconnection cells. As for manmade circuits,
one method for stacking two chips is to flip one over and attach it to
the other using raised metal bumps which serve as a support and as electrical
connectors. Such "flip chips" have been used in military infrared-detecting
"smart Pixel" arrays. Some stacks with more than two layers have
been made using metal interconnections that go all the way through the
silicon wafer. Efforts are also underway to link up several stacked circuit
layers with optical signals that pass through the wafers. One of the problems
here is the lattice mismatch between light-emitting materials and the silicon
substrate. One solution may be the use of "epitaxial liftoff"
(ELO), a technique in which a specially-grown "epilayer" can
be separated from an underlying growth substrate by etching away an intermediate
sacrificial layer. The microns-thick epilayer can then be transferred to
a different host substrate for further processing. (Optics & Photonics
News, April 1994.)
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